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Matthew Burns
Technical Marketing Manager
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Samtec, Inc.
Faster, Denser, Smaller: Enabling High-Performance Embedded Computing Connectivity
RISC-V, GPUs, DSPs, SoCs and good’ol x86 already define next-gen, faster, denser and smaller embedded computing platforms. Routing PCIe® 4.0/5.0, 100 GbE, USB4® and DDR 4/5 signals in chip-down or modular designs pose many challenges for the embedded designer. In this keynote, the presenter will summarize technical challenges while offering practical solutions for design and implementing high-performance embedded computing connectivity.