Supported by:

Embedded Computing

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Mos Days Hrs

8 June 2022

10am - 5pm

9 June 2022

10am - 4pm

LV Convention Center

Supported by:

Embedded Computing

8-9 June 2022

LV Convention Center

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KiranKumar Nagendra: Speaking at the Embedded Tech Convention USA

KiranKumar Nagendra

Associate Vice President of Embedded Systems  -  Tessolve

5G Enabled Service Gateway for Automotive

E/E architecture of automotive vehicles are rapidly changing owing to modernization of electronics inside the car. This has prompted the need for a service gateway which has connectivity to the cloud and the capability to perform edge analytics. This allows real-time user experiences and to perform predicative, prescriptive maintenance.

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About KiranKumar Nagendra

Kiran has spent most of his career focused on embedded product development working from product conceptualization to implementation to sustenance and Life Cycle management. His application expertise includes Automotive, Avionics and Industrial products. Prior to getting into the product space, he also builds ASIC/SoC validation platforms, IP verification platforms. By combining these two areas Kiran has been critical to developing System on Modules on various silicon chipsets, enabling Tessolve to accelerate time to market for customers across various embedded market segments. Now apart from engineering management, Kiran has taken on a business leadership role to strategize on Tessolve’ s Embedded Solutions portfolio and product roadmap.