Supported by:

Embedded Computing

Next Event

::

Mos Days Hrs

8 June 2022

10am - 5pm

9 June 2022

10am - 4pm

LV Convention Center

Supported by:

Embedded Computing

8-9 June 2022

LV Convention Center

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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