Computer-on-Modules – Quick and easy advanced customization

This blog was provided by Congatec

Most of today’s devices feature embedded intelligence. And when OEMs are faced with choosing how to embed this intelligence, they usually think of only two approaches, either traditional motherboards, such as single-board computers (SBCs), or a full custom design. With standard boards, engineers are limited to the specific mechanical/electrical features, interfaces, and footprints provided by these boards and available expansion cards. If other options or features are required, a custom board must be designed.

Bringing customization into a more price-friendly territory
No matter how you slice it, a full custom design is always an expensive endeavor. Although customizing motherboards or SBCs is no different, there’s more to it than just a painful hit to your budget. Additional development time and other drawbacks also come along for the ride. The reason? OEMs are masters of their applications. They’re not experienced board designers. But don’t fret. Another option is available that allows for customization at a more attractive price point.

Enter Computer-on-Modules, which provide the design security and comfort of classic motherboards and the flexibility of full-on custom designs. COMs are mounted on custom “carrier boards” and provide the processor performance you require with a standardized footprint and set of interfaces. In fact, COMs hit the ground running, as they’re application-ready, feature a dedicated BSP that integrates all drivers, and are readily available from a range of vendors.

COMs are a cost-efficient option for developing a custom design with a unique and often more compact footprint, rugged build that meets your demanding requirements and selection of dedicated interfaces that are application-specific. As a consequence, your custom carrier board is simplified, contains fewer layers, and is less expensive. A wide range of CPU modules is also available, allowing for the perfect balance of price and performance.

Excel at the edge with improved scalability
Similar to the design of SpaceX rockets, the carrier board is reusable, which allows you to scale up performance with standard components to serve the expanding needs of edge computing applications. If you need more real-time virtual machines, just add modules with more cores and hypervisor support. And as simple as that, you have more computing power for performing AI-driven data analytics and the like. A distinct advantage of COMs is they’re available with all relevant processors from a specific generation, unlike the limited choice of processors that are normally available for motherboards or SBCs.

Keeping an eye on your ROI
Unlike conventional motherboards that require a completely new custom design for integration of a new processor, COMs can be reused many times over for scaling within a specific processor generation, as well as from one generation to another. You can even switch processor vendors and architectures by simply exchanging the module. The rest remains untouched. Computer-on-Modules thereby provide a better long-term return on your investment for the provision of processor performance and computing features of your embedded system.

Breathing new financial life into “as-a-service”
If we further explore the benefits of COMs, it’s easy to see that their modularity and reusability bring significant benefits to companies that offer edge computing or measurement applications “as-a-service”. When the time comes, as it always does, to upgrade the processor or increase system performance, only the COM needs to be replaced. Since the cost of a new module is only about 50% of your initial investment, and approximately 85% of the physical hardware remains in place, you save money AND avoid making a negative impact on the environment. As a result, companies that offer edge computer or measurement applications “as a service” can now focus on “service” and are no longer in the business of selling entire systems, effectively hitting the trifecta of win-win-win.

Designed to play well with a range of computing power requirements - now and in the future

Not satisfied to rest on their laurels, COM standards are constantly being updated and defined to support ever increasing computing performance and interface speeds that come to market. One example is PCI Express, which is a new 32 GB/s interface implemented by fifth generation Intel Alder Lake processors. PICMG has already been on the case with COM-HPC, which achieves higher performance than the world’s leading COM Express standard and clearly has its sights set on high-performance embedded computer designs. It’s certainly a welcomed standard that supports the latest high-speed interfaces like PCI Express 4.0/5.0 and multiple 25 Gbit Ethernet.

The COM-HPC standard developed by the COM-HPC Subcommittee, which is led by its Chairman Christian Eder from congatec, offers two different module versions: COM-HPC Server and COM-HPC Client . They differ in size, type and number of supported interfaces, as well as total memory

COMs are the pinnacle of versatility when it comes to answering a wide range of computing power requirements. You’re given the choice of different designs and standards that match up perfectly with your needs.

If low power CPUs are required, the independent consortium SGET (www.sget.org) has standardized two specifications – Qseven and SMARC - that allow COMs to support lower power processors like the Intel Atom and AMD G Series, as well as the ARM i.MX6 and i.MX8 platforms from NXP.

If your computing power and interface requirements are on the higher end, the COM Express standard by the PICMG consortium (www.picmg.org) supports much faster CPUs and is the most commonly utilized. This specification defines three different types of Computer-on-Modules – Type 10, Type 6 and Type 7. Type 10 is comparable in size and computing power to Qseven and SMARC. A step up on the power scale is Type 6, which supports CPUs from AMD V2000 to 12th generation Intel Core processors and 24 PCI Express lanes. At the top of the performance range is Type 7, which supports edge server processors and 10 Gbit Ethernet.

Not satisfied to rest on their laurels, COM standards are constantly being updated and defined to support ever increasing computing performance and interface speeds that come to market. One example is PCI Express, which is a new 32 GB/s interface implemented by fifth generation Intel Alder Lake processors. PICMG has already been on the case with COM-HPC, which achieves higher performance than the world’s leading COM Express standard and clearly has its sights set on high-performance embedded computer designs. It’s certainly a welcomed standard that supports the latest high-speed interfaces like PCI Express 4.0/5.0 and multiple 25 Gbit Ethernet.

The COM-HPC standard developed by the COM-HPC Subcommittee, which is led by its Chairman Christian Eder from congatec, offers two different module versions: COM-HPC Server and COM-HPC Client . They differ in size, type and number of supported interfaces, as well as total memory.

Performance that grows with you
If your closed-loop engineering could benefit from converged systems platforms, Computer-on-Modules are just what the doctor ordered. They’re perfect for quickly and easily updating embedded intelligence or designing a trouble-free, custom carrier board with your choice of modules. And due to a wide range of providers and products, you’re not forced into a monogamous relationship with a specific manufacturer. Taken together, COMs are a true recipe for success of your long-term computing needs.

To learn more about Computer-on-Modules, as well as their standards and advantages, register for your FREE ticket to attend the Embedded Technology Convention in Las Vegas on June 8th & 9th, 2022!